Northbrook, Ill.--March 20, 1998--The Institute for Interconnecting and Packaging Electronic Circuits (IPC) has released the first three documents in a series of design standards that will make its IPC-D-275, Design Standard for Rigid Printed Boards and Rigid Printed Board Assemblies, obsolete. The IPC-2220 Design Specification series addresses design capabilities made possible by today's technological advancements that were not covered by the IPC-D-275 document.
The three new IPC-2220 standards address printed wiring board design (IPC-2221), rigid organic PWB design (IPC-2222), and PC card design (IPC-2224).
Other changes have been made to IPC-2221 and 2222 to account for technological advancements in the industry since the 1991 release of the IPC-D-275, including more tables to illustrate the trade-offs between cost, functionality, space and manufacturability of the design; reduced conductor spacing requirements to reflect common practices in the industry; more detailed coverage of palletization; and updated test specimens.
In the coming year, three more standards in the IPC-2220 series will be released: IPC-2223, Sectional Design Standard for Flexible Printed Wiring; IPC-2225, Sectional Design Standard for Single and Multichip Modules; and IPC-2226, Design Standard for High-Density Interconnect Structures (HDIS), IPC's first design standard on high-density interconnects.
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