San Jose, Calif.--May 25, 1998--Cadence Design Systems, Inc.(San Jose) introduced the Advanced PackagingEnsemble software to design and analyze complex packages for ICs.
The suite provides an environment for package design withconstraint-driven physical layout, electrical modeling, andanalysis of package and package-to-PCB considerations. It also uses a common designdatabase throughout the development flow. Those capabilities are in productionuse at more than 30 semiconductor manufacturers, package substrateand assembly vendors, and systems companies around the world includingAnalog Devices; ChipPAC, Inc.; Harris Corp.; GASD, Ibiden Co.LTD.; Kyocera Corp.; LSI Logic Corp.; Siliconware PrecisionIndustries Co., Ltd.; Shinko Electric Industries Co., Ltd.; SumitomoMetal Ceramics, Inc.; and W.L. Gore & Associates.
The Advanced Packaging Ensemble system addresses the requirements ofemerging IC packaging alternatives, such as high-density ball grid arrays(BGA), chip-scale packages (CSP), and direct chip attach (DCA). It uses aconvergent methodology for managing overall system performance that considersthe path from the silicon to the package, the package to the PCB or system,and back to silicon.
The Advanced Packaging Ensemble product is available today for productionshipment starting at $45,000. The suite is fully supported on both Unix and Windows NT-based workstations and across heterogeneous Unix/Windows NT design environments.
Cadence Design Systems, Inc.
San Jose, CA
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