Jerusalem, Israel and Mountain View, Calif.--May 18, 1998-- Shellcase, Ltd.(Mountain View) has announced that Xicor, Inc. (Milpitas, Calif.)has agreed to license the Shellcase wafer-level CSP manufacturingprocess technology and to buy Shellcase CSPs as well. The licensed technologywill be transferred to Xicor's main manufacturing facilities, while Shellcasewill begin CSP production for Xicor in the near future.
The wafer-level technology transfer is a nonending agreement, whileShellcase will provide their true CSP BGA products, the ShellBGA, to Xicor fora number of years.
The immediate need is for ShellBGA, a true die-sized package employingsolder bumps. Xicor plans to incorporate the Shellcase technology-based CSPproducts into a number of its current and future memory products.
Mountain View, CA
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