Marlborough, Mass.--May 18, 1998--PADS Software, Inc. (Marlborough, Mass.) introduced its new high-density interconnect tool, PowerBGA, which has resulted from a partnership with Interchip Systems, Inc. (North Andover, Mass.).Under the terms of the agreement, PADS is working withInterchip Systems to develop high-density interconnect applicationsthat can be integrated into the PADS-PowerPCB environment. The firstof those products, PADS-PowerBGA, automates the interconnect processbetween bare die and a PCB. The system supports the design of BGAs,chip scale packages, laminate-based MCMs, and chip on board. Interchipis standardizing on PowerBGA for their internal development and designof BGAs, chip scale packages, and board designs. In addition, Interchipwill resell PADS' products, and PADS will offer Interchip consultingservices to the company's installed base.
PowerBGA will be available in the fourth quarter of 1998. Pricing ranges from$15,000 to $35,000.
PADS Software, Inc.
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