Semicon West '98, San Jose, Calif.--July 15, 1998--Siemens announced the commercialization of a new electronics packaging format called a Polymer Stud Grid Array Package (PSGA), following development work in collaboration with IMEC, Europe's leading center for microelectronics research.
The PSGA is a single molded substrate of metallized plastic with studsprotruding from the substrate body for connection between the package andthe PCB board with either solder or glued. This is in contrast to the BGA(Ball Grid Array) package which uses solder balls for the interconnection.PSGAs were originally conceived by Siemens Corporate Research in responseto recent packaging trends emphasizing area array connections and chipscale packages for large pin-count ICs, as well as lower costs, higherreliability and smaller package dimensions.
This new package's design and construction makes it suitable for assembly in high-density arrays on printed circuit boards, primarily on those with patterning realized by a new Siemens laser direct write technique. PSGAs also have excellent electrical, thermal andthermo-mechanical performance.
Siemens officials see the PSGA as a performance leader in the nextgeneration of electronics packaging. Typical applications may be invarious information technology products, such as notebook computers and PCcards, cellular phones, intelligent connectors in automation, or otherdomestic or automotive products.
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