San Jose--July 15, 1998--Schlumberger Automated Test Equipment (ATE; San Jose) introduced the ETC 1000, a thermal control system providing precision in semiconductor device thermal control. The ETC 1000 offers die and transistor junction temperature control, especially for high-power devices such as microprocessors and system-on-a-chip ASICs.
The ETC 1000 is based on a new technology that is compatible with any ATE or system test application. The system provides set point temperature switching in addition to thermal control.
Other thermal control systems are physically limited by the amount of heat they can transfer from a device. As power densities increase above 10 Watts/cm squared, the effectiveness to respond to changes in DUT dynamic power reduces quickly with other thermal control systems.
The ETC 1000, which features Power Balancing thermal control, is not limited by that power density barrier. It offers +/-2C junction temperature control for power densities of 30 Watts/cm squared and beyond, and features a -35C to +125C set point temperature range. It's not necessary to attach a heat sink or slug to the device for test. The system also allows thermal profiles and transition rates to be programmed.
Other features include an ATE interconnection for SOT/EOT, on-system data collection, a temperature analysis package, support for standard data formats and charting packages, a touch screen operator interface, PC/NT controls, and a Labview extendible s/w environment.
Schlumberger expects to begin shipping the ETC 1000 during Q4 1998. Pricing begins at $156,000 per unit.
San Jose, CA
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