Northbrook, Ill.--July 15, 1998--The US Army Aviation and Missile Command (AMCOM) has announced that it's awarding a contract for the development and management of a printed circuit board (PCB) research and development facility. The Electronic Circuit Board Manufacturing Development Center (ECBMDC) in Huntsville, Ala., will be managed by the Illinois Institute of Technology Research Institute (IITRI) and a team of industry and academic participants that includes the Institute for Interconnecting and Packaging Electronic Circuits (IPC; Northbrook) and the Interconnection Technology Research Institute (ITRI).
IPC and ITRI will participate in the technical direction, the identification of projects, the formation of project teams, and the implementation of technical programs.
The ECBMDC's mission is to strengthen the United States PCB industry (including US industries that support it) and increase the industry's ability to support military needs through an integrated program of research, education, and industrial extension.
The center will sponsor cooperative research and development projects through a wide-ranging partnership with industry. The ECBMDC has already outlined five initial startup projects, four of which were originated by ITRI:
* High-density; low-cost PCB interconnections. Develop the interconnect density necessary for future high-density electronics, and the platform implementation of Ball Grid Array (BGA) and Chip Scale Packaging (CSP).
* Microvia registration. An investigation of the issues related to the registration in high-density microvia multilayer PCBs.
* PCB substrates for direct chip attachment. A focus on organic chip carriers for single chip and multichip direct-chip applications.
* Multi-layer board compensation factors. An investigation of the issues related to compensation factors for high-density multi-layer PCBs.
* Cost/performance model for advanced frequency operation PCBs. Development of a cost/performance model to reduce design development costs and cycle time for the fabrication of high frequency PCBs.
The ECBMDC's primary facility will begin operations as soon as an on-site management is put in place.
Marshall Andrews, CEO of ITRI
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