East Fishkill, N.Y.--July 13, 1998--IBM (East Fishkill) announced new semiconductor packaging products that can help electronicsmanufacturers integrate more components onto a single microchip. The three new offerings-ultrafine-pitch wire bond plastic ball grid arrays (PBGAs), glass ceramicchip carriers, and multichip modules on laminate (MCM-L)-provide connectivitybetween the chip and the rest of the system, relieving bottlenecks that can occur as morecircuitry is built into each chip.
With the introduction of ultrafine-pitch wire bond PBGA, IBM hascombined standard ceramic technology with printed wire boardprocessing to produce new wire bond interconnect capabilities.Using this process, die pad pitch can be reduced from the 80-mindustry standard to less than 60 m. Off-chip interconnection densities ofmore than 1,000 I/Os can be supported, making this new packaging suitable for 0.18-mprocesses and below, potentially extending the life of wire bond packaging by years.
IBM's glass ceramic chip carrier technology features the industry's highest off-chip andcard-attach densities, with on-package I/O counts of up to 5,000, andoff-package I/O counts of more than 1,600. IBM engineers have made thistechnology accessible by eliminating costly thin films from the glassceramic process. Because there is no thermal mismatch between glass ceramic andsilicon, die size is not limited. IBM's glass ceramic chipcarriers will be able to accommodate die sizes of up to 30 millimeters without chip-to-package reliability concerns. The glass ceramic chip carriers feature full array flip-chip (C4) die attach, allowing for die shrinkand providing improved electrical performance due to shorter interconnect lengths, distributedpower, and ground. Copper conductors can speed the transfer of the signalto the board by up to 28 percent.
The Multichip Module on Laminate (MCM-L) packagingsolutions give customers the ability to package several chips together tosimplify system-level board design and reduce the number of I/Oconnections. Packaging bare die in close proximity results in shorterinterconnect lengths, which can enhance electrical performance throughreduced time of signal transfer to the board, lower capacitance loading,lower cross-talk, and lower off-chip driver power. They feature lightweight, reduced size, low signalline resistance and high DC current that are geared to low to midrange I/O applications.
IBM's MCM-L solutions will be offered from IBM's Worldwide MCM-L Design Center in Vimercate,Italy, with design support available in North America and Japan.
East Fishkill, NY
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