Phoenix--August 26, 1998--Thomas W. Goodman, technology andmarket analyst for the microelectronics packaging industry, has joined FlipChip Technologies, LLC (Phoenix) as the Asia division's technical marketing manager.Goodman will lead FCT's customer and business development and expansionefforts in Asia and will relocate to Tokyo in 1999.
As senior technology analyst for Techsearch International based in Austin,Texas, Goodman has analyzed technologies and emerging markets formicroelectronics packaging. He has published numerous magazine and journalarticles and is an internationally known speaker on packagingtechnologies and markets. In addition, Goodman holds several U.S. patentsin package technology.
Goodman has experience as a research engineer atSony's Central Research Laboratory in Yokohama, Japan and as package andassembly development engineer at Motorola SPS in Phoenix. His technicalexperience includes research and development for high-speed, high-frequencypackaging and new package and process development.
Flip Chip Technologies, LLC
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