Sunnyvale, Calif.--Sept. 29, 1998--Philips Semiconductors (Sunnyvale), Taiwan Semiconductor Manufacturing Company (TSMC; Hsinchu), and the Economic Development Board Investments (EDB) of Singapore announced a joint venture to build a new wafer fabrication facility in Singapore's Pasir Ris Wafer Fab Park.
The facility will produce logic chips in 0.25-mm, 0.18-mm, and under 7,000 square meters of Class One clean room conditions. Construction will begin in early 1999. Full production capacity is targeted for 2003. Construction on the new facility will cost approximately $1.2 billion.
Philips will be the major shareholder in this venture with 48 percent of the shares. TSMC will hold 32 percent and EDB Investments will hold the remaining 20 percent of the shares. The companies will be able to call on respectively 60 percent and 40 percent of the production capacity. The Board of Directors of the joint venture company will be composed of executives from each of the partners.
At full production in 2003, the new facility will employ approximately 875 people. The capacity will be about 360,000 eight-inch silicon wafers per year, giving a potential production in the region of 300 million chips per year.
Return to Headlines