Marlboro, MA - September 29, 2000 - Innoveda, Inc., a provider of software and services for the design of advanced electronic products, today announced the latest version of its advanced package design tool, PowerBGA 3.6.
As the newest version of Innoveda's solution that automates the interconnect process between bare die and a printed circuitboard (PCB), the company said that PowerBGA 3.6 improves design flow and streamlines functionality by enabling engineers to take advantage of GDSII/ASCII file import, rules-driven automatic wire bond fanout, and parametric die, flag and ring construction. Innoveda acquired PowerBGA 3.6 in its recent merger with PADS Software, Inc.
"PowerBGA 3.6 provides engineers with the tools needed to simplify the design process for complex semiconductor advanced package design," said Richard Almeida, vice president of marketing of the PCB group.
PowerBGA 3.6 contains three functionality enhancements:
Die Wizard - This feature enables PowerBGA to read and
filter data exported in GDSII/ASCII formats for die part construction. Since most CAD models are in these formats, importing the native GDSII/ASCII
die files directly into PowerBGA simplifies data transfer and eliminates translation, the company said. When GDSII/ASCII data is unavailable for import, the Die Wizard's parametric construction capability can be used to craft a die part.
Wire Bond Wizard - Wire bonding is the most common die
attachment method for single and few-chip advanced IC packages, and requires the generation of an interconnect fanout pattern. The Wire Bond Wizard streamlines functionality by providing rules-driven automatic wire bond fanout capability within the PowerBGA layout editor, enabling engineers to evaluate routability and substrate bond pad placement trade-offs, the company said.
Die Flag Wizard - Since most single and some few-chip
packages require metal flags and rings under and around the die to supply voltage, the PowerBGA 3.6 Die Flag Wizard enables engineers to define and create die flags, rings, and associated soldermask openings within PowerBGA.
Prices for PowerBGA 3.6 range from U.S. $22,000 to $40,000. This version is scheduled to be available in December 2000. Upgrades to PowerBGA 3.6 are available for existing customers.
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