The threat of a standards war over chip packaging for 300mm wafers loomed last week as a second technology alliance threw its hat into the ring.
The Advanced Packaging and Interconnect Alliance (APiA) says it is "industry's most extensive collaborative effort, focused on the development of comprehensive, risk-free interconnect packaging solutions". Its members include August Technology, Casio Computer, Dainippon Screen Manufacturing, the Flip Chip division of Kulicke & Soffa, Ultratech Stepper and Unaxis Balzers.
APiA was launched one year after the Semiconductor Equipment Consortium for Advanced Packaging (Secap), which seeks "to address challenges in semiconductor packaging, such as the development and validation of process equipment for the industry's conversion to wafer-level packaging and 300mm wafer technology".
Secap counts Semitool, Suss Microtec, Matrix, the Fraunhofer Institute for Reliability and Microintegration and, most recently, Electroglas as its members. Jim Quinn, spokesman for Secap, said: "Can you have two standards? It's probably not efficient. Their charter sets out to do what Secap already does. The foundation of Secap was well planned and thought out. We are not overly surprised to see other people follow that lead."
And he says APiA "misses the point" of Secap, which is neutral regarding the technology of any provider, according to its charter. Quinn described APiA as "trying to get a recommended supplier chain in place".
Unaxis, now an APiA member, resigned from Secap last month "after a decision to strategically align with a packaging technology provider", according to Secap.
APiA was unavailable for comment.