Fujitsu has a chemical-free polishing technology that produces chips as thin as 25µm. Before, technologies have only been able to get thickness down to 100µm.
Thin chips are needed for the development of smartcards and could be used to address growing demand for smaller wireless devices.
Fujitsu has developed technology to support the wafer during the grinding process. The technique consists of holding and supporting the wafer in a jig while it is being polished.
The company claims the purely mechanical process is quicker and cheaper than chemically assisted polishing.