LONDON " Seiko Epson has started sampling the first bridge chip set for the serial Mobile Video Interface (MVI) specification it is trying to establish in conjunction with Renesas Technology as an open standard for the transfer of text and graphics displayed on mobile communications devices.
The bridge chip is meant to act as a temporary solution for connecting main and sub LCDs to base band engines or mobile graphic processors until LCD controllers are available to support the specification. Such parts are expected by the middle of next year. Renesas plans to introduce SH-Mobile processors next year that integrate the interface. Driver ICs integrating the interface will be available from both companies in 2005.
Epson and Renesas proposed the MVI as a standard within the Mobile Industry Processor Interface (MIPI) alliance that is looking to standardize interfaces for baseband and applications processors. However, there are other efforts for high speed serial interfaces, such as that backed by National Semiconductor dubbed Mobile Pixel Link.
The serial Mobile Video Interface will support a maximum data rate of 200 Mbits/second per channel in version 1.0. In version 2.0, to be released in the second quarter of 2005, the maximum data rate will double, to 400 Mbits/s.
The interface defines only the physical layer, leaving customers the freedom to design the upper layers for specific applications.
The interface employs low-voltage differential signaling (LVDS), which reduces power consumption and electromagnetic interference, the companies said. It supports both full- and half-duplex operation.