MagnaChip Semiconductor a worldwide semiconductor foundry, and Advanced Analogic Technologies Incorporated (AnalogicTech), a developer of power management semiconductors for mobile consumer electronic devices, today announced the installation of AnalogicTech's proprietary 0.35-micron multi-voltage mixed-signal ModularBCD process technology in MagnaChip’s advanced 200-mm submicron fabrication facilities in Seoul, South Korea.
AnalogicTech will produce its next-generation power management integrated circuits using ModularBCD wafers manufactured in MagnaChip's high-volume wafer-fab facilities. Volume production is expected to begin in the first quarter of 2006. The ModularBCD devices – boasting higher efficiency, smaller size, new features, and higher levels of integration than present solutions – are designed to manage power and extend battery life in mobile consumer electronic products such as cell phones, portable media players, tablet and laptop computers, and digital cameras.
Rather than adapting aging linear-IC legacy fabs or generic digital CMOS foundry processes, ModularBCD represents the first of a new generation of analog, power, and mixed-signal IC technologies especially created for high-tech wafer fabrication and well suited for manufacture in ex-DRAM fabs. By monolithically integrating fully-isolated CMOS at 3V, 5V, and 12V with high-speed complementary bipolar transistors and robust 30V DMOS power devices without the need for expensive processes (such as epitaxy or high-temperature diffusion), single-chip mixed-signal and system ICs become technically and economically feasible. As a result, ModularBCD ICs benefit from higher integration, improved noise immunity, and enhanced circuit reuse.
MagnaChip to Fabricate ModularBCD Wafers
In addition to manufacturing for AnalogicTech, MagnaChip is licensed to produce ModularBCD wafers for products that do not compete directly with AnalogicTech's power management offerings. Applications that may benefit from ModularBCD technology include motor drivers, data converters, line drivers, display drivers, automotive ICs, mechatronics, analog IC standard products, and various mixed-signal applications. The innovative process technology helps MagnaChip to productively utilize existing facilities previously used to manufacture complex high-density DRAMs.
"This agreement with AnalogicTech is inline with our strategy to specialize our foundry services in the high-voltage, power, and mixed-signal IC markets, while expanding our existing business portfolio in analog semiconductors," said Channy Lee, Executive Vice President and General Manager of Semiconductor Manufacturing Services at MagnaChip. "Our cost-efficient business model and advanced manufacturing services in specialized technology will help our valued customers expand and differentiate their product portfolio in today’s competitive IC market."
"Our long-standing partnership with MagnaChip enables us to capitalize on the benefits of our ModularBCD platform in high-volume production with a world leader in semiconductor manufacturing," said Richard K. Williams, President, CEO, and CTO for AnalogicTech. "We are excited to see its commercialization and we are committed to supporting MagnaChip’s deployment of the technology into the broader semiconductor market."
For more information about MagnaChip visit: www.magnachip.com
Visit the AnalogicTech website at: www.analogictech.com