BRUSSELS, Belgium -- Antenna specialist Fractus has been granted the world's first patent for fractal antenna in package technology, which promises to reduce significantly the cost and simplify the design of a range of wireless devices.
The technology, which allows the antenna, traditionally a separate component, to be integrated with other RF components such as the radio and RF processor, has been granted U.S. Patent No. 7095372.
Fractus (Barcelona, Spain) is working with leading semiconductor manufacturers to bring AiP to market, notably with ST Microelectronics, and has extensive experience developing other short-range wireless solutions with leaders such as CSR, ST Microelectronics, SiGe Semiconductors, Atheros Communications and NXP, formerly Philips Semiconductors.
The company -- and its next stage of evolution -- at the GSM World Congress in February. Dubbed Full Wireless System in Package, that is aimed at manufacturers lacking RF expertise.
The AiP development allows an antenna to be incorporated on to the IC and accommodate multiple bands (frequencies) to support numerous short-range wireless standards, including Bluetooth, WLAN, UWB and ZigBee.
"The ability to integrate the antenna into the semiconductor package will dramatically reduce product development and manufacturing costs for OEMs and ODMs worldwide" said Dr. Carlos Puente, CTO and IPR Director at Fractus.