BRUSSELS, Belgium Nokia has developed a version of its HSDPA connectivity module that Intel will use in the next iteration of Centrino targeted at PCs.
The Centrino Duo mobile technology platform will offer the high speed data rate connectivity module as an embedded option in a variety of notebooks.
The development is part of Intelís next-generation mobile processor platform, including support for the emerging 802.11n Wi-Fi standard. Intel disclosed details of the platform at this weekís Intel Developer Forum.
The platform, scheduled for introduction in the first half of next year, will improve upon Intelís Core 2 Duo processor by offering new power saving capabilities in the central processing unit (CPU) and a faster front-side bus from 667- to 800-MHz.
"This collaboration is good news for notebook users as cellular technology offers superior connectivity and mobility for notebook and other portable device users. This is also a natural area for Nokia's multiradio expertise to expand to," said Heikki Tenhunen, head of Nokia's Connectivity Module Business Program.
Intel will take care of platform design, software, integration and support as well as sales and marketing. Nokia brings to the collaboration its 3G HSDPA expertise as well as mobile network carrier relationships. Nokia will manufacture the module.