LONDON --- German chemicals group BASF and IBM are to partner on the development of specialst electronic materials required in the production of ICs using the 32-nm node process technology under development.
The companies suggest both the process and the related chemicals and materials will be commercialized by chip makers by 2010.
No financial or technical details were revealed about the joint development. The research will be carried out jointly at IBM's facilities in Yorktown Heights, U.S. and BASF's headquarters in Ludwigshafen, Germany.
"We are taking a big leap forward to face the future challenges of the IC industry," Ralf Fink, Senior Manager BASF Electronic Materials, said in a statement Friday (June 22). "The cooperation will benefit from IBM's leading semiconductor process development and BASF's expertise and innovations in chemicals and nanotechnology," he added.
Ronald Goldblatt, Distinguished Engineer and Senior Manager, IBM Research, commented: "Chemistry will increasingly play an important role in the development of the next generation (32-nm) IC products. BASF will provide an extensive and interdisciplinary background that only a major chemical company can offer, and long years of experience in the field of semiconductor-related chemical solutions."