MUNICH; Germany With its new coating cluster Gamma XPress, Suss MicroTec addresses chip manufacturers who use advanced packaging. The machine can be used for wafer bumping as well as for LED manufacturing applications.
The cluster is offered in different configurations carrying price tags between 100.000 (about $138.000) and half a million euros, explained a spokesperson. The machine can be configured for specific applications including gold bump coating, under bump metal or redistribution coating, high volume LED coating as well as standard and dry film developing.
According to Suss, the advanced packaging technology is used in a broad variety of manufacturing processes. Customers are predominantly in the foundry business.