Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced the industry‚s lowest power zero-crossover operational amplifier (op amp). Featuring a unique single-input-stage architecture, the OPA369 achieves rail-to-rail performance without input crossover to solve the common design problem of input offset distortion due to the change in common mode voltage that is very prominent in low-voltage, rail-to-rail applications. Combined with 1µA quiescent current, SC70 package and operation down to 1.8V, the OPA369 simplifies high-performance designs in battery-powered, portable products. (See http://www.ti.com/opa369-pr.)
„The OPA369 utilizes TI‚s innovative zero-crossover topology and next-generation CMOS process technology to offer precision performance previously unavailable in 1µA single-supply amplifiers,‰ said Art George, senior vice president of TI‚s high-performance analog business. „Typically, designers are forced to choose between power consumption and the AC or DC performance of their signal conditioning amplifiers. The OPA369 will enable customers to increase the precision in their portable applications without complicating the design or increasing their power budget.‰
The single-input stage architecture delivers outstanding offset voltage of 750µV over the entire rail-to-rail input range and a common-mode rejection ratio (CMRR) of 100dB minimum, thereby maximizing the useable input dynamic range for low supply voltage applications. Other features include low noise of 120nV/rtHz, gain bandwidth of 12kHz on 1µA, low input bias current of 50pA maximum, low voltage offset drift of 1.75µV/°C (max), PSRR of 94dB and low 1/f noise of 3.6µVp-p (0.1 to 10Hz)
The OPA369 offers the precision, low power and small packaging required in a wide variety of applications such as portable medical devices (glucose meters, oxygen metering), portable instrumentation (gas detection/monitoring, handheld test equipment), sensor signal conditioning and portable consumer devices.
TI provides customers with a state-of-the-art signal chain solution for portable applications: analog-to-digital converters such as the ADS1100; digital-to-analog converters such as the DAC8811; and precision voltage references such as the REF33xx. The OPA369 is also optimized to work with TI‚s MSP430 ultra-low-power microcontroller family.
Availability and Packaging
The dual OPA2369 is available now from TI and its authorized distributors in SOT23-8 and MSOP-8 packages. Suggested resale pricing for the OPA2369 starts at $1.20 in 1,000-piece quantities.
The single OPA369 is sampling now, with volume production scheduled for 4Q 2007. The device is available in an SC70-5 package and suggested resale pricing starts at $0.80 in 1,000-piece quantities. In addition, TINA-TI SPICE-based analog simulation software is available for easy-to-use circuit simulation.
TI offers analog engineers a wide-ranging support infrastructure that includes training and seminars, design tools and utilities, technical documentation, evaluation modules, an online KnowledgeBase, a product information hotline and a comprehensive offering of samples that ship within 24 hours of request. For more information on TI's complete analog design support, and to download the latest Amplifier and Data Converter Selection Guide, visit www.ti.com/analogelab.
Texas Instruments Incorporated provides innovative DSP and analog technologies to meet our customers‚ real world signal processing requirements. In addition to Semiconductor, the company includes the Educational & Productivity Solutions business. TI is headquartered in Dallas, Texas, and has manufacturing, design or sales operations in more than 25 countries.
Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at www.ti.com.
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Note: The above text is the public part of the press release obtained from the manufacturer (with minor modifications). EETimes Europe cannot be held responsible for the claims and statements made by the manufacturer. The text is intended as a supplement to the new product presentations in EETimes Europe magazine.
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