LONDON STMicroelectronics has teamed with Automotive Communications Systems (ACS, Ann Arbor, MI) to develop silicon for the Vehicle and Infrastructure Integration (VII) initiative that is investigating the potential safety benefits of car-to-car and car-to-roadside communications.
Contributors to VII activities include leading car companies from all continents, the U.S.government, state governments, and numerous automotive component suppliers.
The aim is to roll out on-board equipment on all new vehicles sold in North America and the Federal Government will install infrastructure on major roadways. The program is part of a plan to improve roadway safety and utilization, lower travel times, and provide better and more intelligent access to information for drivers.
ST Microelectronics brings to the partnership its expertise in the development of ICs for the automotive sectors, including in communications and location, as well its semiconductor production know-how, while ACS brings a patent pending architecture for resolving some of the major challenges facing the VII initiative such as channel access, reliability of communications, and precision vehicle location at a much lower cost than current solutions.
"There is clearly enormous potential for the technology that ACS brings to solving problems facing the VII program," said Ugo Carena, Corporate VP and General Manager, Automotive Products Group, STMicroelectronics. "STMicroelectronics’ capability in automotive, wireless communication, and location, coupled with ACS’ technology will provide significant advantages to the government, auto companies, and their suppliers."