LONDON Analysts of the developing 3G baseband silicon market at Deutsche Bank are clearly not respecters of market share in the larger mobile communications market for its own sake.
In a note issued to clients at the end of February the Deutsche Bank analysts divided 3G baseband chip supplying companies into four tiers based on their understanding of the roadmaps and execution status of 11 companies.
Deutsche Bank restricts its tier one to four companies. Qualcomm and Texas Instruments, the two leading suppliers of silicon for mobile handsets, are included in the top rank. The other two are Ericsson Mobile Platforms and privately-held Icera Inc. As a private company Icera's annual sales have not been disclosed but they will be a tiny fraction of the billions of dollars of annual sales attributed to the wireless market leaders.
The bank puts STMicroelectronics NV, the company with third largest annual wireless revenues at about $1.5 billion according to market researcher iSuppli Inc., in the fourth tier of suppliers. And NXP, with the fifth largest annual wireless revenues at $1.4 billion according to iSuppli, is in the third tier.
"...Qualcomm has a much wider range of products shipping than any of the others. More shocking is that even at this late date there are still so few vendors actually shipping product. On a merchant basis, that is vendors selling to any and all handset vendors, there are really only three HSDPA vendors; Qualcomm, EMP and privately-held Icera," the analysts said.
Deutsche Bank's second tier comprises Freescale, Infineon and Broadcom. The third tier is NXP, Marvell and NEC.