LONDON French research group CEA-Léti (Grenoble) and Brewer Science (Rolla, MO), Inc. have extended their partnership on the development of 3-D chip stacking processes to create a common laboratory.
The researchers will also collaborating on the development of photosensitive and non-photosensitive coatings for MEMS manufacturing processes.
The groups started working together in October 2007 on the integration of Brewer’s WaferBond materials into 3-D chip stacking process flows to achieve reliable, processes for ultra-thin wafer handling and processing. The first full integration process was completed late last year.
"We have, in a very limited time, achieved and characterized Unity Aspect Ratio vias on 70 microns thick wafers," said Nicolas Sillon, the Head of the Laboratory for advanced packaging and 3-D integration at Léti. "The developed technology based on WaferBond materials will accelerate the 3-D chip stacking projects we have at Léti."
Tony Flaim, Chief Technology Officer at Brewer Science added the three-year extension would also feature MEMS process flows.
Focus will be on development and integration of photosensitive and non-photosensitive coatings into MEMS manufacturing processes, where high aspect ratios are mandatory, and on organic coating layers for advanced KrF and ArF photoresist processes.
"Introducing advanced, tailored products will provide a very competitive advantage in the development of innovative technologies for MEMS, their packaging and their integration," said André Rouzaud, Deputy VP Microsystems at Léti.
Brewer Science focuses on coating solutions for applications such as lithography, advanced packaging, MEMS, nanotechnology, optoelectronics and compound semiconductors.
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