LONDON The consolidation in the semiconductor market is set to continue as Toshiba Corp. plans to create a joint venture in Japan with two packaging groups, Amkor Technology and Nakaya Microdevices, in a bid to cut costs.
The move follows confirmation earlier this week that Renesas and NEC Electronics are preparing to merge their semiconductor activities, and suggestions by analysts that Toshiba may respond by seeking a merger itself, potentially with Fujitsu's chip operations.
Toshiba said on Tuesday (April 28) it would unload wafer testing equipment to the venture, which would then assemble its system chips.
Nakaya Microdevices, 15 percent-owned by private equity firm Carlyle Group, plans to take a majority stake in the venture, which will be set up in October, the companies said in a statement.
Toshiba has previously worked closely with Amkor on packaging and test.