LONDON Silicon & Software Systems Ltd. (Dublin, Ireland), a licensor of mixed-signal circuits for consumer products and provider of semiconductor chip design services, has announced that S3 has completed the design of Percello's PRC6000 chipset.
Percello (Ra'anana, Israel) is a UMTS/LTE femtocell baseband chip vendor, which has achieved backing from German mobile phone service operator T-Mobile to support the development of the PRC6000. According to S3 the PRC6000 is the first system-chip dedicated to the emerging 3G UMTS and HSPA+ femtocell market. As part of the collaboration S3 dealt with 65-nm process technology, clock distribution, DDR2 and handoff to the foundry manufacturer, the company said.
The PRC6000 chip supports backhauling architectures and functions such as timing and security and is compliant to the 3GPP HNB Rel-8 standard. It supports up to eight users simultaneously and is capable of data transmissions of 21.6-Mbps downlink and 5.76-Mbps uplink.
"S3 proved to be the perfect partner for taping out the PRC6000 in TSMC's 65-nm CMOS." said Rafy Carmon, vice president of R&D at Percello. "S3 committed to Percello's aggressive schedule and low-power low-cost silicon goals. We are very pleased with the cooperation and collaboration between the engineering teams which facilitated our very fast design cycle."
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