LONDON Alchimer SA, the Massy, France-based provider of wet deposition processes for interconnections in 3D packaging applications, has raised $10 million in Series D funding. Backers include AGF, CEA Investissement and Emertec Gestion.
The money is earmarked for expanding customer-support programs and pursue new IP development.
The company is a spinoff from the CEA in France.
"The continued support of investors, especially in this difficult economic environment, is a solid endorsement of Alchimer's innovative technology," said Alchimer CEO Steve Lerner. "It also underscores the impact of Alchimer's electrografting technology in enabling the emerging 3D market through process enhancement and cost reduction."
Alchimer recently announced an enhancement of its eG ViaCoat process for the copper seed metallization of through-silicon vias (TSVs), which are used to create interconnections in advanced 3D-packaging applications. These structures are typically very narrow in comparison to their depth; this high aspect ratio creates a number of challenges to the deposition of uniform films.
In further evidence of the company's increasing acceptance as a low-cost alternative for TSV copper seed and related films, Alchimer announced that it has signed an agreement with Nagase & Co. Ltd., a Tokyo-based technology-marketing company focusing on the chemicals, plastics and electronics sectors.
"Nagase will allow us to take advantage of synergies in the chemical and electronics markets and ensure excellent support for our customers in Japan,"Lerner said.
Separately, the company also announced that Kathy Cook has been hired in a new position, director of business development in North America. Cook has held positions in manufacturing, sales and business development within the semiconductor industry for more than 15 years, with companies including Applied Materials, Millipore Corp., ULVAC Technologies and SUSS MicroTec.