PARIS Soitec SA (Bernin, France) and Corning Inc. (Corning, N.Y.) have concluded an agreement in a view to develop advanced substrates for the flat panel mobile display market.
Corning said it is currently developing a process to bond high-quality silicon wafers onto glass, providing substrates which will be useful for growing electronic circuits, and appropriate for special semiconductor, display and imaging applications. This emerging technology, known as silicon on glass, or SiOG, will be used for Soitec and Corning substrates development.
Corning specified that its SiOG technology is expected to enable high image resolution, full-motion video and low-power consumption for small- to medium-sized mobile display devices.
Under their codevelopment work, Soitec and Corning said they intend to tackle key challenges to broad commercialization of the high-quality, cost-effective displays promised by mobile OLED technology, including backplane electron mobility and uniformity as well as lower total system cost.
A key focus will be placed on top-performance substrate technology for OLED mobile displays, partners specified.
"Together we hope to create low-cost, high-performance substrates for the mobile flat panel market," commented Soitec president André-Jacques Auberton-Hervé. "In addition to the focus on mobile display substrates, the codevelopment work can explore alternative applications for engineered substrates using glass and semiconductor thin films, which could significantly enlarge our portfolio of applications."