LONDON Fabless semiconductor company Black Sand Technologies Inc. (Austin, Texas) has said it has produced an RF power amplifier for 3G communications in CMOS and claimed it is the world's first.
The company said it has a proprietary PA architecture that improves on the combination of performance, cost, battery life and reliability. Black Sand's RF PA products are targeted at mobile phones and other 3G wireless devices, such as datacards and netbooks.
A French design services company called Acco Semiconductor SA raised $10 million to <www.acco-semi.com pursue the same goal.
"By leveraging our breakthrough PA architecture, Black Sand, as the first company to deliver 3G PAs in CMOS, is ready to capitalize on the historic shift from GaAs to CMOS, and benefit from the explosion in demand for new 3G devices appearing on the market today," said John Diehl, CEO of Black Sand Technologies, in a statement.
Black Sand Technologies was founded in 2005 and seeks to combine sensitive analog, digital and power circuits in silicon. The company did not disclose who it is using to make its designs or how soon its product will be in mass production.
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