Commack, NY Where is $3 trillion in global stimulus money is going? How will it impact and change the mega trends shaping the future of the electronics industry? What are the fundamental technologies upon which the success of that industry will depend? Which technologies will lose out?
These are but some of the questions Lisa Su, chief technology officer at Freescale, will answer at next week's Embedded Systems Conference in San Jose.
While it may be easy to get caught up in the angst of the moment, seeing beyond the current difficulties to where future opportunities may lie is the only recipe for success in a rapidly evolving electronics industry. Few are as aware of those emerging opportunities as Su, having spent many hours tracking the rising tide of global stimulus spending, how that spending correlates with embedded market drivers and then identifying the enabling technologies that are needed to achieve success meeting the needs of those drivers.
"I'm very optimistic about where we are going," said Su. Commenting on the injection of capital brought about by the stimulus plans, she sees it as, "an opportunity to accelerate what's going on." And what's "going on" has a lot to do with green, connected intelligence and automotive.
In her keynote, Su will elaborate upon the specifics of global spending in each of those three areas, and which technologies stand to benefit the most.
For example, "Telecom infrastructure has been very underplayed," she said, and the awarding of 3G licenses in China, coupled with the move to Long Term Evolution (LTE) technologies, more consumer demand for associated handheld devices and the stimulus money going into such infrastructure, "will change the game," she said. In fact, based on her own user experience, Wi-Fi networks may lose out and become redundant in many areas, depending on 3G coverage.
However, wireless is only the tip of the iceberg, and at next week's keynote Su will expand upon the opportunities in automotive safety and efficiency, the rise of homogenous and heterogenous multicore processors and what they mean for embedded programmers, and how a costly ASIC development cycle may mean that there'll be less emphasis on developing 'unique' ASICs and more emphasis on advanced packaging as a key enabler.
Near and dear to her heart will be more advanced network processing capabilities, which will be of fundamental to the rise of Web 2.0, cloud computing and other 'connected intelligence' applications upon which Su will elaborate.