The 6th International Semiconductor Forum, which is to be held on 2nd and 3rd June in Munich, Germany, will this year highlight European analog/mixed-signal, plus MEMS expertise. The jointly-organised event by the Global Semiconductor Alliance (GSA) and the Institution of Engineering and Technology (IET), will feature several special panel sessions discussing how to leverage European expertise in analog/mixed-signal (A/MS), wireless and MEMS applications.
Whilst the event is aimed at European semiconductor executives, the meeting signals a renewed focus by the GSA on A/MS issues, according to Jodi Shelton, executive director of the GSA. "We have made great strides in helping to create an efficient ecosystem for the digital world (although our work is never done!), and we have now been tasked by our EMEA Leadership Council to help accelerate a similar ecosystem for the analog/mixed-signal domain." Intimating that there is a sizeable task ahead, she adds: "Where standards in the digital world help create efficiencies, there is little standardisation in analog, few good EDA tools exist, and strong reusable third-party A/MS IP is rare."
"The GSA has long been focused on A/MS with an active committee in the U.S. that has created among other things a PDK checklist and other tools to help companies and foundries in this domain," notes Sheldon. Now, the organisation has formed a European A/MS Interest Group, chaired by Paul Double, director of eda Solutions. To create an analog ecosystem, the group will seek to address the need for better models, analog process selection, enabling IP reuse, and the challenge of 'over-customisation', which makes it harder to have proven IP blocks.
Among the topics under discussion at the ISF event will be a session moderated by Maria Marced, president of TSMC Europe and a member of the A/MS Interest Group, looking at the major infrastructure and support challenges facing analog/mixed-signal design, including the need for more A/MS third-party IP options and analog design automation tools. Benedetto Vigna, group vice president and general manager of STMicroelectronics' MEMS & sensors, transceivers & healthcare division, will provide an overview of MEMS trends and statistics, including discussion of the drivers of MEMS commercialisation. Meanwhile, Lip-Bu Tan, president and chief executive officer of Cadence Designs Systems, will chair a 'town hall' discussion between various European ceos, including David Baillie, CamSemi; Joep van Beurden, CSR; Stan Boland, Icera; Simon Atkinson, Mirics Semiconductor and Tudor Brown, president, ARM.
For more information on the event, visit the event's website
Analog process selection made simple