CHENGDU, China -- Communications equipment giant Cisco Systems Inc. has recently expanded its efforts in Chengdu, China.
Cisco has set up a new office at the Chengdu Tianfu Software Park, the largest software park in China. Chengdu Tianfu Software Park Co. Ltd., a subsidiary of Chengdu Hi-tech Investment Group, was founded under the leadership of the Administration Committee of Chengdu Hi-tech Zone in 2009 to operate Tianfu Software Park.
Tianfu Software Park has completed two phases, which consists of 1.1 million-square-meters. Two other phases are on the drawing board.
As one of the 11 national software bases in China, Chengdu is said to have up to 1.65 million technicians, and 130 000 software practitioners, according to the Chengdu Tianfu Software Park.
For the past year, a large number of enterprises,including Accenture, DHL, Maersk, Alibaba, Manulife, Amazon, and Wipro, selected Chengdu Tianfu Software Park to implant their back-offices, R&D centers or development centers to take advantage of the talent pool and low operation costs.
Last year, Cisco announced a smart-grid collaboration with the Chengdu municipal government under a memorandum of understanding. The Tianfu Smart+Connected City pilot project will be launched by Cisco together with Chengdu in the city's High-Tech Zone.
Cisco will also cooperate with educational and research institutions in Sichuan to expand its research and development investments. As part of a sponsorship and research agreement with the University of Electronic Science and Technology of China, Cisco aims to establish a joint green research lab in Chengdu's High-Tech Zone.
Chengdu is the capital of Sichuan province. Chengdu boasts a population of over 11 million people. Chengdu, a transportation and communication hub in Western China, seeks to become the next major base for the development of ICs, information technology (IT) and other sectors in the nation.
Intel Corp. owns and operates a giant IC-packaging facility in Chengdu. Semiconductor International Manufacturing Corp. (SMIC) operates a 200-mm fab in the area, but there are reports that Texas Instruments Inc. may soon take ownership of the facility.
Seeking to break out from the crowded IC-packaging pack, Malaysia’s Unisem Berhad here outlined its ambitious growth strategy amid robust demand and shortages in the market. As part of the program, IC-packaging and test specialist Unisem (Kuala Lumpur) plans to expand in Chengdu, develop an automotive expertise and look for acquisitions in the market.