Freescale's Chengdu design center is located at the Chengdu Tianfu Software Park, reportedly the largest software park in China. Chengdu Tianfu Software Park Co. Ltd., a subsidiary of Chengdu Hi-tech Investment Group, was founded under the leadership of the Administration Committee of Chengdu Hi-tech Zone in 2009 to operate Tianfu Software Park.
Tianfu Software Park has completed two phases, which consists of 1.1 million-square-meters. Two other phases are on the drawing board. As one of the 11 national software bases in China, Chengdu is said to have up to 1.65 million technicians, and 130 000 software practitioners, according to the Chengdu Tianfu Software Park.
Chengdu, a transportation and communication hub in Western China, seeks to become the next major base for the development of ICs, information technology (IT) and other sectors in the nation.
Intel Corp. owns and operates a giant IC-packaging facility in Chengdu. Semiconductor International Manufacturing Corp. (SMIC) operates a 200-mm fab in the area, but there are reports that Texas Instruments Inc. may soon take ownership of the facility.
Seeking to break out from the crowded IC-packaging pack, Malaysia’s Unisem Berhad here outlined its ambitious growth strategy amid robust demand and shortages in the market. As part of the program, IC-packaging and test specialist Unisem (Kuala Lumpur) plans to expand in Chengdu, develop an automotive expertise and look for acquisitions in the market.