SAN FRANCISCOIntellectual property licensor Ceva Inc. has licensed its dual MAC, 32-bit Ceva-TeakLite-III DSP core to Infineon Technologies AG for use in future mobile phone and modem platforms, the companies said.
This latest agreement, which extends an existing relationship between the two companies, enables Infineon to leverage the features and processing performance offered by the latest generation Ceva-TeakLite-III DSP architecture while maintaining code compatibility with the existing Ceva-based Infineon architectures, according to Ceva (San Jose, Calif.).
“DSP plays an essential role in overall power consumption and performance in handsets and the Ceva TeakLite-III DSP brings to Infineon the capability to dramatically improve future wireless and multimedia processor designs,” said Gideon Wertheizer, CEO of Ceva, in a statement.
Ceva says DSP cores power many of the world's leading handsets today, with all top five handset OEMs shipping Ceva-powered phones. To date, more than 700 million Ceva-powered handsets have shipped worldwide, from ultra-low cost devices to smartphones, according to the company.