ANAHEIM, CA Chip design companies need to redefine relationships with their manufacturing partners, and foundries must create a new model that brings manufacturing and design into an integrated and collaborative process.
Keynoter Doug Grose, chief executive officer of GlobalFoundries, made these assertions at the Design Automation Conference here today.
"Chip design continues to increase in complexity, driven by product requirements that demand exponentially more performance, functionality and power efficiency, integrated into a smaller area. In parallel, manufacturing technology is facing increased challenges in materials, cost and shorter product lifecycles."
This confluence of factors puts the industry at a crossroads and the foundry industry at center stage, according to Grose.
The next generation of chip innovation needs to leverage an integrated global ecosystem of talent and technology.
In effect, "the world’s top design companies want more than a contract manufacturer; they want a level of collaboration and flexibility supported by a robust partner ecosystem of leading providers in the EDA, IP and design services sectors."
"We need a very well-choreographed approach of collaboration at 22 nm," said Grose.
As he laid out such a coordinated approach for taping out a chip after a typical 30-month product cycle from product definition to product architecture to product development to product validation and finally tapeout, Grose challenged the semiconductor, IP and EDA industries towork together with the foundries to make a "cultural transformation of collaborating by trusting each other and providing transparency to drive a new re-aggregation of the semiconductor value chain.
"As in the Ron Howard Apollo 13 film 'falure is not an option' for making collaboration work in our industry," said Grose.