PARIS The Electronics and Information Technology Laboratory of the CEA (CEA-Leti) of France and Docea Power SAS (Moirans, France) announced they have sealed a laboratory agreement to combine their expertise in 3D silicon integration as well as thermal and low power design.
CEA-Leti said it will use Docea's tools for power and thermal analysis at the architectural level to build 3D-IC designs and methodologies for developing advanced applications consumer and wireless.
The purpose of such collaboration, partners highlighted, is to improve design quality and validate a new generation of high-level design tools, like Docea’s Aceplorer, for 3D-IC wireless and consumer applications.
"With its specific dynamic compact thermal models for 3D packaging and dies, our Aceplorer platform will enable power and thermal modeling of stacked dies, including the 3D interconnect using through-silicon vias (TSVs) and re-distribution layers (RDLs) and the power distribution across multiple layers,” stated Ghislain Kaiser, CEO of Docea Power. "Collaborating in a common lab with Leti, and benefiting from its broad and deep expertise in 3D-IC technology, gives us the opportunity to validate and improve our platform for addressing the fast-growing 3D stacked-IC market."
At this year's DAC in Anaheim, Calif., Docea has introduced Aceplorer 2.0, a new version of its system-level power and thermal modeling platform.
Aceplorer 2.0, the French startup indicated, adds project management capabilities to boost productivity and a link to virtual platforms to assess the impact of complex scenarios and embedded software on a system’s power consumption.
In a commentary of Aceplorer 2.0, Kaiser declared: "In most design projects, around 80 percent of the blocks are reused with some variation from previous designs. Within these legacy designs, there is a tremendous amount of data from power simulations at the gate level or from netlists and from measurements. It can take hours of simulations and testbench setups to extract this data, and now with Aceplorer 2.0 it can be exploited by system architects."