LONDON Toshiba has announced the launch of a 128-gigabyte embedded NAND flash memory module, claiming it is the highest capacity yet achieved in the industry.
The module is compliant with the e-MMC v4.4 standard, and is designed for use in digital consumer products, including smartphones, tablet PCs and digital video cameras. Samples will be available in September, and mass production is due to begin in the fourth quarter of 2010, Toshiba said.
The 128-Gbyte memory integrates sixteen 64-Gbit NAND chips fabricated in 32-nm process technology plus a dedicated controller IC into a 237-ball FBGA package measuring 17-mm by 22-mm by 1.4-mm. Toshiba has applied chip thinning and layering technologies together with wire-bonding to realize individual chips that are only 30-microns thick.
Samples of 64-Gbyte chips constructed in the same way and in the same package are due to be available from August.
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