Embedded Systems Conference
Breaking News
News & Analysis

Trio forms 3-D chip alliance

6/21/2010 03:18 PM EDT
2 comments
NO RATINGS
More Related Links
View Comments: Newest First | Oldest First | Threaded View
mark.lapedus
User Rank
Author
re: Trio forms 3-D chip alliance
mark.lapedus   6/23/2010 5:53:49 AM
NO RATINGS
Resistion, I agree. There is some inconsistency. In the article, I reported what Elpida, UMC and Powertech said. But I really don't believe it. They may have a concept. They are not close to putting TSV in production. Elpida and UMC are full of hot air.

resistion
User Rank
Author
re: Trio forms 3-D chip alliance
resistion   6/22/2010 10:51:56 AM
NO RATINGS
I was a little confused by this announcement, for two reasons. First, there were earlier comments that "TSVs not yet ready for prime time." Second, those more confident in TSVs would tend to support furthering its development over the next few years. Now we have this announcement, which is a third case, saying something like "we are ready to roll it out next year." A lot of inconsistency.

Most Recent Comments
Susan Rambo
 
MFahmy0
 
cd2012
 
junko.yoshida
 
MikeD95101
 
betajet
 
junko.yoshida
 
Bill_Higdon
 
Tom_C
Flash Poll
April 2015 Cartoon Caption Contest: The Mighty Hamster
April 2015 Cartoon Caption Contest: The Mighty Hamster
Of all the exhibits in the Pre-Apocalypse Era Museum, Breek was always in awe of the unearthed details and true-to-scale reproduction of a technological creation space that the long gone humans had once inhabited.
149 comments
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed