SAN JOSE, Calif. -- Unisem Advanced Technologies (UAT) is expanding its wafer
bumping capacity in its factory in Ipoh, Malaysia.
The bumping facility’s floor space will be increased by 100 percent.UAT expects the equipment that
will provide this new additional capacity to be in place and available to
customers beginning this September.
“We have seen tremendous demand from our customers for wafer bumping during
the current industry upturn,” stated C.H. Ang, Group COO of the Unisem Group, in a statement.
Malaysia's Unisem is an IC-packaging and test house.
UAT is a joint venture between Unisem, Advanpack Solutions and FlipChip