LONDON ó Chip
manufacturing capacity utilization was running at close to 100 percent
in most leading-edge nodes in the second quarter of 2010, according to
the Semiconductor International Capacity Statistics (SICAS)
organization. The numbers show that the industry's total manufacturing
capacity stayed approximately constant in Q2 despite a significant
increase in manufacturing capacity by foundries.
fab capacity utilization hit 95.6 percent in the second quarter of
2010, up from 93.5 percent in the first quarter, according to the
organization, which collects production statistics from around the world
on behalf of the industry. The industry's total capacity was 2.126
million 200-mm equivalent wafer starts per week, up by 0.9 percent
sequentially but down 0.2 percent compared with Q2 2009.
older process technologies above 100-nm and production on 200-mm wafers
had risen to close to 90 percent and leading-edge CMOS production below
100-nm and production on 300-mm diameter wafers is at 95 to 98 percent.
At the 90-, 65- and sub-60-nm nodes it was 94.6, 98.8 and 98.6 percent
respectively. This is despite a remarkable increase in manufacturing
capacity at foundries.
manufacturing capacity was 407,000 wafer starts per week, up 5.9 percent
sequentially and up 41.2 percent compared with a year before. Wafer
starts increased by 10.6 percent sequentially and 67.8 percent compared
with Q2 2009 with the result that foundry manufacturing capacity hit
98.8 percent. Only a year before foundry capacity utilization had been
at 83.1 percent and the quarter before that at 50.1 percent.
on 300-mm wafers reached 98.4 percent capacity utilization, up from 96.9
percent in the first quarter, despite a substantial increase in
Bill Jewell of
Semiconductor Intelligence LLC (Dallas, Texas) said he expects IC
capacity utilization to increase through the rest of 2010, from 95.6
percent in the second quarter and reaching 96 percent in the fourth
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