Design Con 2015
Breaking News
News & Analysis

STATS opens 300-mm wafer-level BGA plant

9/20/2010 04:53 PM EDT
1 Comment
NO RATINGS
View Comments: Newest First | Oldest First | Threaded View
selinz
User Rank
CEO
re: STATS opens 300-mm wafer-level BGA plant
selinz   9/20/2010 9:17:40 PM
NO RATINGS
This is more evidence that Infineon's eWLB is truly catching some serious air. This is one of several techologies that extend Wafer level CSP type packaging to smaller die.

Radio
LATEST ARCHIVED BROADCAST
EE Times Senior Technical Editor Martin Rowe will interview EMC engineer Kenneth Wyatt.
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Flash Poll