PARIS – Atrenta Inc. announced it has opened a R&D center in Grenoble, France, that will focus on advanced power reduction and 3D stacked die design.
The company said plans for the R&D center include the development of advanced power reduction capabilities and 3D design techniques, which leverage semiconductor process technology advances in stacked die configurations and through silicon via (TSV) structures.
The advanced power reduction work aims to enhance the verification, estimation and reduction capabilities of Atrenta’s SpyGlass-Power product suite. Then, the 3D design work will be focused on early physical prototyping of 3D integrated circuit stacks, and will leverage the company’s SpyGlass-Physical and 1Team-Genesis products, the company said.
Atrenta explained that the R&D center will be part of Atrenta France SAS (Paris, France). The company is now finalizing plans for office space in the Grenoble area that can house up to twenty researchers. It has hired Fahim Rahim, Ph.D. as director of engineering for the facility.
Also, Atrenta said it is in the process of joining French and European industrial research clusters, including Minalogic micro, nanotechnologies and software competitiveness cluster and CATRENE (Cluster for Application and Technology Research in Europe on NanoElectronics).
"Significant advances in semiconductor process technology are now making 3D stacked die configurations a reality," stated Dr. Ajoy Bose, chairman, president and CEO of Atrenta. "The design of these structures poses substantial challenges however. Grenoble is an excellent location where design and process development come together. This, coupled with a significant focus in the area on advanced power reduction makes for an ideal ecosystem to support our new R&D center. Atrenta France SAS is committed to building a world-class team in the Grenoble area."
Headquartered in San Jose, Calif., Atrenta has offices in the United Kingdom, Germany, India and Japan.