SAN JOSE, Calif. - South Korean foundry vendor Dongbu HiTek has qualified its 180-nm mixed-signal process and EEPROM intellectual property (IP) to meet the quality and reliability criteria set forth in the automotive AEC-Q100 ‘Grade 0’ standard.
The company’s 0.35-micron BCDMOS (BD350) process and other nonvolatile memory modules are currently being qualified to the same AEC-Q100 stress level. The company has begun offering an automotive package for selected CMOS and BCDMOS processes, with plans to add more processes in the near future.
“As one of the very first foundries to earn the ISO/TS 16949 quality/reliability certification in 2003, we have expanded our capabilities to manufacture automotive ICs,'' said H.S. Park, Dongbu HiTek's vice president of quality & reliability, in a statement
“Our enhanced IP for implementing EEPROM NVM functions in our BD350 process offers the flexibility to finely trim analog parameters such as voltages and currents in the package to reduce development time by up to six months,'' Park said. ''These NVM-enabled chips will operate reliably for more than 10 years at temperatures up to 150°C, as it supports operating voltages over the widely used 2.5-to-5.5V range.”
Now available for MS180 and BD350 process technologies, Dongbu HiTek’s automotive package features 180°C SPICE models and 150°C characterizations for components and all IP and NVM blocks. It also provides differentiated automotive-specific IP blocks, two certified wafer fabs and connections through its ecosystem. Moreover, guard-ring and ESD guidelines are included plus a 15-year record retention.
Analog foundry vendor Dongbu HiTek has kept a relatively low profile. But with little or no fanfare, the South Korean company is bucking the trend and expanding its reach despite a sudden slowdown in the IC market.The fab capacity at Dongbu (Seoul) is fully booked right now and will be sold out at least until the end of this year.