SAN JOSE, Calif. - After some delays, Intel Corp. has officially opened its new IC-packaging and test plant in Vietnam, according to reports.
The Ho Chi Minh City facility, announced in 2006, was supposed to begin production by the end of 2009. But Intel ran into some problems with the contractors, causing a delay with the plant.
For some time, Intel said the $1 billion Vietnam factory would begin production in mid-2010.
''In July 2010, Intel Vietnam began using the latest Intel chipset technologies to produce chipsets that will help support the growth of the mobile computing. In fact, Intel Vietnam started the use of the latest FCBGA binding technology for mobile processors,'' according to Intel's Web site.
''This facility is the first investment of its kind in the semiconductor industry in Vietnam. The new 500,000 square foot facility will eventually employ as many as 4,000 people and will be the model for larger, more efficient assembly test facilities that will make Intel even more competitive,'' according to the firm.
This week, Intel has begun operations within its first fab in China, according to Dow Jones. Intel is also expanding in the U.S. As reported, Intel recently confirmed speculation that it will build a new R&D wafer fab in Hillsboro, Ore., and upgrade other existing U.S. facilities for 22-nm production at a total investment of between $6 billion and $8 billion.
The investment will create 800 to 1,000 permanent high-tech jobs and 6,000 to 8,000 construction jobs, Intel (Santa Clara, Calif.) said. The new development fab in Oregon, to be known as D1X, is slated for R&D startup in 2013.
One analyst thinks the fab will be ''450-mm ready.''