Design Con 2015
Breaking News
News & Analysis

Applied rolls fast, 'intelligent' etcher

11/29/2010 10:00 PM EST
6 comments
NO RATINGS
View Comments: Oldest First | Newest First | Threaded View
daleste
User Rank
CEO
re: Applied rolls fast, 'intelligent' etcher
daleste   11/29/2010 11:47:51 PM
NO RATINGS
It is good to see advancements in tool technology. We will need more advancements in this area to control process costs and turn times in the future.

ChrisGammell
User Rank
Rookie
re: Applied rolls fast, 'intelligent' etcher
ChrisGammell   11/30/2010 9:33:23 PM
NO RATINGS
And yet still no announcements about 450mm wafers. Not surprising how hard it is to get uniform across 300mm, let alone adding even more real estate to etch. I'm looking forward to hearing how they'll tackle 450mm.

docdivakar
User Rank
CEO
re: Applied rolls fast, 'intelligent' etcher
docdivakar   12/6/2010 6:20:06 PM
NO RATINGS
@MarkLaPedus: it would be nice to know the throughput you mention (up to process up to 180 wafers an hour) is also valid for high aspect ratio TSV applications. Perhaps the eight process chambers for TSV applications might just as well make it a reality. AS a proponent of 3D via TSV technology, I welcome this introduction to reduce cost per wafer. How ever, it would also be nice to know the limitations of the etch process using this tool for TSV's. Dr. MP Divakar

Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed
Top Comments of the Week