SAN JOSE, Calif. - The Defense Advanced Research Projects Agency (Darpa) is funding a research collaboration between Singapore's Institute of Microelectronics (IME), a research institute of the Agency for Science, Technology and Research (A*STAR), and University of Washington’s Department of Electrical Engineering.
The partnership will result in the development of a parallel assembly technique to assemble ultrathin chips. The entities will also devise a three-dimensional (3-D) micro-electro-mechanical-systems (MEMS) high density capacitor with increased energy storage for portable systems and a microsensor that detects human dehydration levels.
IME will provide expertise in the development, simulations and early stage fabrication for these developments. UW will contribute lab-scale process development and theoretical analysis on the parallel assembly technique project.