Breaking News
News & Analysis

Microsoft calls for 16-core server SoCs

1/27/2011 08:03 PM EST
14 comments
NO RATINGS
More Related Links
View Comments: Oldest First | Newest First | Threaded View
<<   <   Page 2 / 2
t.alex
User Rank
Author
re: Microsoft calls for 16-core server SoCs
t.alex   1/29/2011 11:35:20 AM
NO RATINGS
It is obvious ARM is mainly for mobile devices still. For servers, it is a different story.

resistion
User Rank
Author
re: Microsoft calls for 16-core server SoCs
resistion   1/29/2011 1:52:51 PM
NO RATINGS
Msft still too small a server player.

fergie1965
User Rank
Author
re: Microsoft calls for 16-core server SoCs
fergie1965   1/29/2011 6:05:42 PM
NO RATINGS
~2/3rds of ARM shipments go into mobile applications. Of, the other 1/3rd, a lot of these units go in the microcontroller area. But there is a pretty respectable amount of "A" profile processors into automotive infotainment, TVs and other home gadgets. Definitely on a path to number 1 in the digital TV space with 3 of the top 4 now shipping ARM Powered platforms. But yes, the point in time where ARM has meaningful market share in applications such as servers and networking infrastructure equipment is years, not months, away.

rick merritt
User Rank
Author
re: Microsoft calls for 16-core server SoCs
rick merritt   1/31/2011 1:28:22 AM
NO RATINGS
@Robotics Developer: Just to clarify, the Windows division of Msoft will support ARM in its next-gen product. Dileep, who is a thought leader in the division of Msoft that runs big data centers, is more bullish on x86 retaining its dominance in the server-system space than he is on ARM making any big in-roads there anything soon given the huge s/w support issues beyond Windows.

<<   <   Page 2 / 2
Most Recent Comments
michigan0
 
SteveHarris0
 
realjjj
 
SteveHarris0
 
SteveHarris0
 
VicVat
 
Les_Slater
 
SSDWEM
 
witeken
Most Recent Messages
9/25/2016
4:48:30 PM
michigan0 Sang Kim First, 28nm bulk is in volume manufacturing for several years by the major semiconductor companies but not 28nm FDSOI today yet. Why not? Simply because unlike 28nm bulk the LDD(Lightly Doped Drain) to minimize hot carrier generation can't be implemented in 28nm FDSOI. Furthermore, hot carrier reliability becomes worse with scaling, That is the major reason why 28nm FDSOI is not manufacturable today and will not be. Second, how can you suppress the leakage currents from such ultra short 7nm due to the short channel effects? How thin SOI thickness is required to prevent punch-through of un-dopped 7nm FDSOI? Possibly less than 4nm. Depositing such an ultra thin film less then 4nm filum uniformly and reliably over 12" wafers at the manufacturing line is extremely difficult or not even manufacturable. If not manufacturable, the 7nm FDSOI debate is over!Third, what happens when hot carriers are generated near the drain at normal operation of 7nm FDSOI? Electrons go to the positively biased drain with no harm but where the holes to go? The holes can't go to the substrate because of the thin BOX layer. Some holes may become trapped at the BOX layer causing Vt shift. However, the vast majority of holes drift through the the un-dopped SOI channel toward the N+Source,...

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed