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Analyst: TSMC to take 'bite of apple'

3/11/2011 01:01 AM EST
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selinz
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re: Analyst: TSMC to take 'bite of apple'
selinz   3/15/2011 1:41:19 AM
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The Apple is big enough for several to be full.

yalanand
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re: Analyst: TSMC to take 'bite of apple'
yalanand   3/11/2011 6:07:06 PM
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Apple had no choice but to choose TSMC over Samsung because samsung is directly competiting with Apple Ipad. This is huge win for TSMC.

the_floating_ gate
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re: Analyst: TSMC to take 'bite of apple'
the_floating_ gate   3/11/2011 5:13:00 PM
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Apple can scream and shout but reality is they are highly dependable on Samsung to procure leading edge components - maybe one reason to diversify and give some business to TSMC Samsung announces wide I/O DRAM with TSVs for mobile apps by Dr. Phil Garrou, contributing editor February 27, 2011 - Samsung -- who in December 2010 announced 40nm 8GB RDIMM based on 4Gb, 1.5V, 40nm DDR3 memory chips operating at 1,333MHz and 3D TSV chip stacking architecture for servers applications -- announced at the International Solid-State Circuits Conference (ISSCC, Feb. 20-24 in San Francisco) the development of wide I/O 1Gb DRAM for mobile applications like smartphones and tablet computers. The 3D TSV architecture will be implemented in their 50nm node DRAM technology. Previous generations of mobile DRAM, low-power DDR2 DRAM (LPDDR2) which runs at approximately 3.2-Gb/ sec, uses a maximum of 32 pins for I/O. The new wide I/O solution, which has 512 I/O (up to 1200 total pins), can transmit data at a rate of 12.8Gb/sec, resulting in a significant improvement in processing power. In addition it reportedly reduces the power consumption by 75%. Following this wide I/O DRAM launch, Samsung is reportedly focusing on 20nm, 4Gb wide I/O mobile DRAM for delivery in 2013. The 64.34mm2 is made up of 4 partitions symmetric with respect to the chip center, each partition consisting of 4×64Mb arrays, peripheral circuits and microbumps. The microbumps are 20×17µm2 on 50µm pitch. The TSVs are 7.5µm diameter with 0.22 - 0.24O resistance and 47.4fF capacitance. Samsung_wideIO_DRAM_510width http://www.electroiq.com/index/display/packaging-article-display/9055095252/articles/advanced-packaging/packaging0/integration/tsv/2011/2/samsung-announces.html

Derek Chew
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re: Analyst: TSMC to take 'bite of apple'
Derek Chew   3/11/2011 2:55:34 AM
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Interesting news. However I was under the impression that Samsung provided Apple a turn key (fab + packaging) solution. If TSMC is providing the A5 silicon, I'm guessing it will go back to Samsung for packaging?

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