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Analyst: TSMC to take 'bite of apple'

3/11/2011 01:01 AM EST
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selinz
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re: Analyst: TSMC to take 'bite of apple'
selinz   3/15/2011 1:41:19 AM
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The Apple is big enough for several to be full.

yalanand
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re: Analyst: TSMC to take 'bite of apple'
yalanand   3/11/2011 6:07:06 PM
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Apple had no choice but to choose TSMC over Samsung because samsung is directly competiting with Apple Ipad. This is huge win for TSMC.

the_floating_ gate
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re: Analyst: TSMC to take 'bite of apple'
the_floating_ gate   3/11/2011 5:13:00 PM
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Apple can scream and shout but reality is they are highly dependable on Samsung to procure leading edge components - maybe one reason to diversify and give some business to TSMC Samsung announces wide I/O DRAM with TSVs for mobile apps by Dr. Phil Garrou, contributing editor February 27, 2011 - Samsung -- who in December 2010 announced 40nm 8GB RDIMM based on 4Gb, 1.5V, 40nm DDR3 memory chips operating at 1,333MHz and 3D TSV chip stacking architecture for servers applications -- announced at the International Solid-State Circuits Conference (ISSCC, Feb. 20-24 in San Francisco) the development of wide I/O 1Gb DRAM for mobile applications like smartphones and tablet computers. The 3D TSV architecture will be implemented in their 50nm node DRAM technology. Previous generations of mobile DRAM, low-power DDR2 DRAM (LPDDR2) which runs at approximately 3.2-Gb/ sec, uses a maximum of 32 pins for I/O. The new wide I/O solution, which has 512 I/O (up to 1200 total pins), can transmit data at a rate of 12.8Gb/sec, resulting in a significant improvement in processing power. In addition it reportedly reduces the power consumption by 75%. Following this wide I/O DRAM launch, Samsung is reportedly focusing on 20nm, 4Gb wide I/O mobile DRAM for delivery in 2013. The 64.34mm2 is made up of 4 partitions symmetric with respect to the chip center, each partition consisting of 464Mb arrays, peripheral circuits and microbumps. The microbumps are 2017m2 on 50m pitch. The TSVs are 7.5m diameter with 0.22 - 0.24O resistance and 47.4fF capacitance. Samsung_wideIO_DRAM_510width http://www.electroiq.com/index/display/packaging-article-display/9055095252/articles/advanced-packaging/packaging0/integration/tsv/2011/2/samsung-announces.html

Derek Chew
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re: Analyst: TSMC to take 'bite of apple'
Derek Chew   3/11/2011 2:55:34 AM
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Interesting news. However I was under the impression that Samsung provided Apple a turn key (fab + packaging) solution. If TSMC is providing the A5 silicon, I'm guessing it will go back to Samsung for packaging?

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