LONDON – Texas Instruments Inc. has said its wafer fab in Miho, Japan, is on schedule for a return to full production by mid-July — meaning chips shipments in September — while its fab in Aizu is on track for full production by mid-April or earlier.
Both fabs were closed by the earthquake that hit Japan on March 11. However, TI said the production recovery schedules at both Miho and Aizu assume a "stable source of electrical power." And full production at pre-earthquake levels depends on an end to the rolling black out regime currently in place across large swathes of Japan.
Meanwhile the company said it has found alternate manufacturing sites for about 80 percent of Miho's work load include TI factories in Dallas and Richardson, Texas, and Freising, Germany.
In addition, TI described its supplier situation as "dynamic" with many companies only just resuming operations. TI made particular reference to the availability of 300-mm diameter wafers.
The Miho fab produced about 10 percent of TI's output as measured by revenue in 2010, of which more than a third was DLP, with the remainder being analog, TI said.
"Assuming a stable source of electrical power." Considering the rolling blackouts in Japan, I feel it will be difficult for fabs to function to their capacities, whether or not there was a direct damage to their equipment during the quake!
TI has been very transparent with the situation post-earthquake. Good news is that they have identified alternate locations for the devices being rolled out of Miho and hence the ripple effect down to the customers should be limited.
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