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Si2 to form 3-D IC standards group

4/26/2011 05:48 AM EDT
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docdivakar
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re: Si2 to form 3-D IC standards group
docdivakar   4/28/2011 9:20:22 PM
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@unknown multiplier: there is minimal impact on the PCB developers by 3D TSV technology. In fact, 3D TSV's help alleviate the routing congestion on the PCB/motherboards as the number of I/O's in the package are increasing. A prime example would be an FPGA for 100Gig/40Gig motherboards -with differential signaling and the 12-lane transmit/receive (and the required grounds to isolate signals), this is going to choke the board design. So some functions of the boards including power management can be answered effectively by 2.5D/3D option. On an energy consumption level, 3D/2.5D makes sense. In fact, the joule/bit metric is ages apart from side-by-side on the motherboard vs. 3D stacked/2.5D stacked/lateral designs in favor of the latter. Dr. MP Divakar

Rchandta1
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re: Si2 to form 3-D IC standards group
Rchandta1   4/26/2011 7:39:42 PM
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3D IC means fewer components, like processor and memory merging into a single chip. Probably lead to reduced business for PCB.

unknown multiplier
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re: Si2 to form 3-D IC standards group
unknown multiplier   4/26/2011 8:41:11 AM
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Wouldn't motherboard or PCB developers be strongly impacted by 3DIC or TSV developments?

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