Embedded Systems Conference
Breaking News
News & Analysis

FEI claims ion beam breakthrough for MEMS, 3-D ICs

6/13/2011 06:07 PM EDT
2 comments
NO RATINGS
More Related Links
View Comments: Oldest First | Newest First | Threaded View
R_Colin_Johnson
User Rank
Author
re: FEI claims ion beam breakthrough for MEMS, 3-D ICs
R_Colin_Johnson   6/13/2011 7:41:13 PM
NO RATINGS
3-D chip makers can now accelerate their development efforts with FEI's new Vion too, according to Fraunhofer, the European research lab that is developing advanced chip stacks. MEMS devices, which also work on the micron-scale, should be able to benefit from quicker metrology and characterization.

wilber_xbox
User Rank
Author
re: FEI claims ion beam breakthrough for MEMS, 3-D ICs
wilber_xbox   6/19/2011 2:02:25 PM
NO RATINGS
Using mA current instead of nA current can surely help analyzing circuits faster. I am not aware of the history of the ion-beams as to why other companies did not use higher current before. One hurdle that i can think of is higher charge interaction thus loss in resolution.

Flash Poll
April 2015 Cartoon Caption Contest: The Mighty Hamster
April 2015 Cartoon Caption Contest: The Mighty Hamster
Of all the exhibits in the Pre-Apocalypse Era Museum, Breek was always in awe of the unearthed details and true-to-scale reproduction of a technological creation space that the long gone humans had once inhabited.
149 comments
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Times on Twitter
EE Times Twitter Feed